Recently, there have been frequent good news about the application of technology and market breakthroughs in the semiconductor module field. In core application tracks such as new energy vehicles, AI data centers, and optical communications, the market share of domestic manufacturers has continued to increase, and the overall industry prosperity has steadily risen.
In the field of new energy vehicles, semiconductor modules, as core components of motor control systems and high-voltage platforms, have seen their demand continuously expand along with industrial upgrading. Data shows that the global power module market size reached 8.489 billion US dollars in 2025, among which the new energy vehicle sector accounted for 33%, becoming the largest application segment. With the 800V high-voltage platform becoming the mainstream in the industry, the penetration rate of silicon carbide (SiC) MOSFET modules has rapidly increased due to their advantages of lower loss and higher power density. By 2025, the proportion of domestic new energy vehicle silicon carbide electronic control installations exceeded 18.7%, and the proportion of domestic manufacturers' silicon carbide module installations surpassed that of foreign manufacturers for the first time, reaching 52.7%. Automotive-grade modules from leading manufacturers such as Sida Semiconductor and Silan Microelectronics have entered the supply chains of many mainstream automakers.
The construction of AI computing power infrastructure has become a brand-new growth pole for semiconductor modules. The iteration of AI large models has driven the construction of ultra-large-scale data centers, and the two major fields of high-speed optical interconnection and efficient power supply have driven the explosive demand for semiconductor modules. In the field of optical communication, Changguang Huaxin just obtained a patent for the preparation of semiconductor lasers in May this year. The domestic 980nm single-mode communication module and 800G optical engine have achieved mass production, and the 1.6T optical engine is also in the final stage of research and development, providing core support for the all-optical interconnection of AI data centers. In the power supply field, the demand for SiC power modules in 48V server power supplies has soared. Compared with traditional silicon-based modules, SiC solutions can increase power supply efficiency to over 97%, perfectly meeting the energy efficiency requirements of high-performance computing clusters.
In addition, in fields such as industrial automation and photovoltaic energy storage, the domestic substitution of IGBT modules is also accelerating. New technologies such as double-sided heat dissipation and copper sintering interconnection have been implemented, driving the performance of domestic products to gradually catch up with that of international first-line brands. Currently, the market share of domestic IGBT module manufacturers has exceeded 30%, doubling compared to five years ago. Industry analysts say that the continuous explosion of emerging downstream demands, coupled with the technological iteration of domestic manufacturers, still provides a vast space for domestic substitution in the semiconductor module field. It is expected that the compound growth rate of the Chinese market will remain above 10% in the next five years.